A novel method for establishing an electrical connection between a contact carrier and an associated mating contact carrier has been developed at the Biomedical Microtechnology Lab and has now been patented. The advantage of the process lies in the possibility of reliably and stably electrically connecting even densely packed contact arrays. The inventors of the process, Dr. Juan Sebastian Ordonez, Sharif Khan and Prof. Dr. Thomas Stieglitz, have also increased the long-term stability of the connection and reduced the probability of failures by using spring-elastic elements. The hermetically sealed electronic assembly and possible connections with biocompatible material enable safe and long-term stable use in electrically active implants.